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BackHttps://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=79, NSMD pad definition Appendix A BGA 1156 1 FF1156 FFG1156 FFV1156 Virtex-7 BGA, 42x42 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=303, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row style2 pin1 right Through hole angled pin header SMD 1x24 2.00mm single row style2 pin1 right Through hole angled socket strip SMD 1x34 2.00mm single row style2 pin1 right Through hole angled socket strip THT 2x27 2.54mm double row SMD IDC box header, 2x13, 2.00mm pitch, 4.2mm pin length, double cols (from Kicad 4.0.7), script generated Through hole socket strip SMD 1x27 1.00mm single row style1 pin1 left Surface mounted socket strip SMD Solder 3-pad Jumper, 1x1.5mm Pads, 0.3mm gap, open.
- Number: 22-27-2091, 9 Pins (http://www.molex.com/pdm_docs/sd/559320210_sd.pdf), generated with.
- Normal -9.468859e-01 -3.215698e-01 0.000000e+00 vertex -1.030079e+02 1.033858e+02 1.855000e+01.