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2-pin TO-92 horizontal, leads molded, narrow, drill 0.75mm, hand-soldering variant with enlarged pads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot556-1_po.pdf 24-Lead Plastic Shrink Small Outline Package (MS) [MSOP], variant of 8-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size 10.8x29.5mm 11x-dip-switch SPST.

22.5x10.3mm^2 drill 1.3mm pad 2.5mm.
6.896696e+000 -1.719637e+000 9.983999e+000 vertex 3.043209e+000 -6.442358e+000.
0.7054 -0.06948 0.705395 facet normal -0.075425.
65.75; //mm fourth_row = 88.25; //mm.

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