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26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=299, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 1x07, 1.27mm pitch, double rows Through hole straight pin header, 1x33, 1.00mm pitch, double rows Surface mounted socket strip SMD 2x05 1.27mm double row Through hole pin header SMD 2x02 2.00mm double row Through hole pin header SMD 2x31 2.54mm double row Through hole pin header SMD 1x09 1.27mm single row Through hole straight pin header, 1x34, 1.27mm pitch, single row (https://gct.co/files/drawings/bc065.pdf), script generated Through hole angled pin header THT 2x05 2.54mm double row Through hole angled socket strip, 1x38, 2.00mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole angled socket strip SMD 1x38 1.00mm single row (from Kicad 4.0.7), script generated Surface mounted pin.

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