Labels Milestones
Back1 FH1761 FHG1761 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=93, NSMD pad definition Appendix A Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268, NSMD pad definition Appendix A Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=298, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=94, NSMD pad definition Appendix A BGA 484 0.8 SB484 SBG484 SBV484 Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=95, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, single row style2 pin1 right Through hole IDC header, 2x12, 2.54mm pitch, 8.51mm socket length, double rows Through hole IDC header, 2x20, 1.00mm pitch, 2.0mm pin length, double rows Through hole angled pin header, 2x11, 1.00mm pitch, double rows Surface mounted socket strip THT 2x38 2.54mm double row Through hole angled pin header, 2x17, 2.00mm pitch, single row style2 pin1 right Through hole.
- Normal 0.680175 0.733049 -0 facet normal -8.184141e-01.
- -3.476637e-003 6.247023e-001 vertex -4.055689e+000 -8.726244e-001 2.484855e+001 facet.
- 9.695134e+01 1.058658e+01 facet normal -0.768509 -0.630625 0.108196.
- Body - hole // Hole.