Labels Milestones
BackDSBGA, 3.0x1.9x0.625mm, 28 ball 7x4 area grid, YZR pad definition Appendix A BGA 400 0.8 CLG400 CL400 Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=77, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 3.0x1.9x0.625mm, 28 ball 7x4 area grid, YZP, YZP0010, 1.86x1.36mm, 10 Ball, 3x4 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf ST WLCSP-100, off-center ball grid.
- -6.260352e+000 -3.300258e+000 1.747200e+001 vertex -6.149543e+000 3.418378e+000 1.747200e+001.
- -9.996063e-01 -2.805777e-02 -1.366702e-07 vertex -1.045770e+02 9.890126e+01.