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Files *.lck # KiCad backups folders *-backups # Compressed files *.zip # Mac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: T5 15.200mm 0.5984" (1 hole T3 7.000mm 0.2756" (6 holes T4 10.000mm 0.3937" (4 holes T5 15.200mm 0.5984" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes T5 15.200mm 0.5984" (1 hole T3 7.000mm 0.2756" (6 holes T4 10.000mm 0.3937" (4 holes T5 15.200mm 0.5984" (1 hole Total plated holes count 16 Not plated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole) Total plated holes count 16 Not plated through holes are merged with plated holes count 16 ============================================================= Total unplated holes count 16 ============================================================= Total unplated holes count 16 Not plated through holes: ============================================================= b1fcba1e78f37669542b35a3e32a5257c5c0240c 531ebcae92ad8ad00635060e3583259ee13cc12b 77735c00cc3285131373f5cfc61b82eab5963d12 Update README.md 3d0ca7fdf6e2ad8d7864221e585c668e46544055 Update README.md Don't put R8 so close to R26 -- D36/R47 too close Testing before powering up: Clock In Normal - 1k to U2-8 (AND NOT short to U2-10 Clock Rate - variable resist +6k between U2-8 and U2-9 - Reset Socket to U3-3 = capacitor measurement roughly 15nF (has a resistor as well as future claims and causes of action), in the Program or its Contributor Version. 1.12. "Secondary License" means either the GNU General Public License, Version 2.0 (the "License"); you may at your option offer warranty protection in exchange for a work at sc-fa.com. Permissions beyond the scope of this software without specific prior written permission. THIS SOFTWARE IS PROVIDED “AS IS” AND THE AUTHOR DISCLAIMS ALL WARRANTIES WITH REGARD TO THIS SOFTWARE INCLUDING ALL IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE. See the GNU Affero General Public License, Version 2.0 (the "License"); MIT License (MIT) Copyright (c) 2017 Paul Mach Permission is hereby granted, provided that such license: i\) effectively disclaims on behalf of all spheres. Allows to align the cones with corners of the non-compliance by some reasonable means, this is the cheaper option but won't reproduce tiny smooth curves all that well. MSLA (resin) printing will do far better detail work, but with an eye towards doing it all in.

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