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B5P-VH-B (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator connector JST GH series connector, DF3EA-10P-2H (https://www.hirose.com/product/document?clcode=CL0543-0332-0-51&productname=DF3EA-5P-2H(51)&series=DF3&documenttype=2DDrawing⟨=en&documentid=0001163317), generated with kicad-footprint-generator ipc_gullwing_generator.py SOP, 8 Pin (http://ww1.microchip.com/downloads/en/devicedoc/20005514a.pdf#page=35), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 502426-5010, 50 Pins per row (https://datasheet.lcsc.com/lcsc/1811040204_JUSHUO-AFC07-S32FCC-00_C11061.pdf Jushuo AFC07, FFC/FPC connector, FH12-16S-0.5SH, 16 Pins per row (http://www.molex.com/pdm_docs/sd/428192214_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 20-Lead Plastic Quad Flat, No Lead Package (MF) - 3.3x3.3x1 mm Body [WSON], http://www.ti.com/lit/ml/mpds421/mpds421.pdf WSON-16 3.3 x 1.35mm Pitch 0.4mm 8-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_16_05-08-1709.pdf DHC Package; 18-Lead Plastic DFN (4mm x 4mm) (see Linear Technology 05081707_A_DHD16.pdf DH Package; 16-Lead Plastic Small Outline (SSO/Stretched SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true SSO Stretched SO SOIC 1.27 16 12 Wide 16-Lead Plastic TSSOP (4.4mm); Exposed Pad (see https://www.diodes.com/assets/Datasheets/AP2204.pdf SSOP 0.50 exposed pad (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-20-85/ Infineon SO package 20pin with exposed pad (http://cds.linear.com/docs/en/datasheet/34301fa.pdf SSOP 0.65 exposed pad (http://cds.linear.com/docs/en/datasheet/34301fa.pdf SSOP 0.65 exposed pad 8-Lead Plastic Dual Flat, No Lead Package (MC) - 2x3x0.9 mm Body [TQFP] With 4.5x4.5 mm Exposed Pad Variation BB; (see Linear Technology DFN_16_05-08-1706.pdf DHD Package; 16-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf DCB Package 8-Lead Plastic Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/84299/vor1142b4.pdf SSO Stretched SO SOIC 2.54 8-Lead Plastic WSON, 4x3mm Body, 0.5mm Pitch, https://www.diodes.com/assets/Datasheets/AP22913.pdf WLCSP-4, 0.64x0.64mm, 4 Ball, 2x2 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf BGA 12 0.5 R-XBGA-N12 Texas Instruments, NDQ, 5 pin (https://www.ti.com/lit/ml/mmsf022/mmsf022.pdf TO-PMOD-11 11-pin switching regulator package, http://www.ti.com/lit/ml/mmsf025/mmsf025.pdf Vishay PowerPAK SC70 single transistor package http://www.vishay.com/docs/70487/70487.pdf powerpak sc70 sc-70 dual Vishay PowerPAK SC70 single transistor package http://www.vishay.com/docs/70487/70487.pdf powerpak sc70 sc-70 dual Vishay PowerPAK SC70 dual transistor package http://www.vishay.com/docs/70486/70486.pdf TO-46-4 with Valox case, based on the other - ground planes are copper fill applied everywhere.

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