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Hole IDC header, 2x08, 2.00mm pitch, single row Through hole angled socket strip, 1x28, 2.00mm pitch, 6.35mm socket length, double rows Through hole socket strip SMD 1x33 1.00mm single row style2 pin1 right Through hole straight pin header, 2x06, 2.54mm pitch, 8.51mm socket length, single row Through hole angled pin header, 2x06, 1.00mm pitch, single row (from Kicad 4.0.7), script generated Through hole angled socket strip SMD 1x14 2.54mm single row (from Kicad 4.0.7!), script generated Through hole angled pin header, 2x10, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled pin header SMD 1x25 1.00mm single row style2 pin1 right Through hole straight socket strip, 1x26, 1.27mm pitch, 4.0mm pin length, single row style2 pin1 right Through hole socket strip SMD 2x13 2.00mm double row Through hole straight pin header, 2x07, 2.54mm pitch, single row Surface mounted socket strip THT 2x21 2.00mm double row Through hole socket strip THT 1x27 2.00mm single row style1 pin1 left Surface mounted socket strip THT 2x33 1.00mm double row Through hole straight socket strip, 2x23, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x02, 2.00mm pitch, 6.35mm socket length, double cols (from Kicad 4.0.7), script generated Through hole angled pin header THT 2x07 2.54mm double row Through hole socket strip THT 1x08 1.27mm single row 0.8 mm BGA-64, 10x10 raster, 4.775x5.041mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f411vc.pdf WLCSP-49, 7x7 raster, 2.999x3.185mm package, pitch 0.5mm; see section 7.8 of http://www.st.com/resource/en/datasheet/DM00387108.pdf Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area grid, YBG pad definition, 0.704x1.054mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb15cc.pdf#page=119 ST WLCSP-52, ST die ID 464, 2.58x3.07mm, 36 Ball, 6x6 Layout, 0.5mm Pitch, S-PVSON-N10, DRC, http://www.ti.com/lit/ds/symlink/tps61201.pdf 3x3mm Body, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wl54jc.pdf ST UFBGA-121, 6.0x6.0mm, 121 Ball, 11x11 Layout, 0.5mm Pitch, https://www.adestotech.com/wp-content/uploads/AT25SL321_112.pdf#page=75 WLCSP 12 1.56x1.56 https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BMM150-DS001-01.pdf WLCSP-12, 6x4 raster staggered array, 1.403x1.555mm package, pitch 0.4mm; http://www.fujitsu.com/global/documents/products/devices/semiconductor/fram/lineup/MB85RS1MT-DS501-00022-7v0-E.pdf Infineon LFBGA-292, 0.35mm pad, 17.0x17.0mm, 292 Ball, 20x20 Layout, 0.8mm Pitch, https://www.ti.com/lit/ml/mpbg777/mpbg777.pdf BGA 289 0.8 ZAV S-PBGA-N289 Texas Instruments, VQFN-HR RNN0018A (http://www.ti.com/lit/ds/symlink/tps568215.pdf QFN, 16 Pin (https://www.renesas.com/eu/en/www/doc/datasheet/isl8117.pdf#page=22), generated with kicad-footprint-generator Tantalum Capacitor SMD 1825 (4564 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator Molex Micro-Fit 3.0 Connector System, 43045-1821 (alternative finishes: 43045-222x.

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