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SPST Copal_CVS-03xB, Slide, row spacing 15.24 mm (600 mils), Socket, LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 20-lead surface-mounted (SMD) DIP package, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 6-lead though-hole mounted DIP package, row spacing 5.08 mm (200 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 3x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 25.4mm.

• Mounted through PCB, vertical BNC RF.
• -0.118608 0.286346 0.950757 vertex.
• -0.834578 0.268415 0.481075 facet normal.
• 0.291191 0.188007 0.938009 facet normal.
• 3.5236174,8.8582672 h -0.19685" d="M 2.4803057,3.0511816.

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