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6.25mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf TFBGA-265, 17x17 raster, 14x14mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l072kz.pdf WLCSP-49, 7x7 raster, 2.965x2.965mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UCBGA-49, 7x7 raster, 2.965x2.965mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UCBGA-49, 7x7 raster, 2.999x3.185mm package, pitch 0.4mm; see section 6.8 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf WLCSP-144, 12x12 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=260, NSMD pad definition Appendix A BGA 484 1 FG484 FGG484 Artix-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=300, NSMD pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=270, NSMD pad definition Appendix A Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=302, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments EUW 7 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils), SMDSocket, LongPads 64-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket, LongPads 6-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 24-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket 20-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket THT DIP DIL PDIP 2.54mm 7.62mm 300mil 1x-dip-switch SPST Copal_CHS-01B, Slide, row spacing 10.16 mm (400 mils 12-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads 18-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils DIL DIP PDIP 2.54mm 10.16mm 400mil LongPads 5-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 12-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 42-pin zero.

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