3
1
Back

Outline (ST)-4.4 mm Body [TQFP] With 4.5x4.5 mm Exposed Pad [eTSSOP] (see Microchip datasheet http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf MLF, 20 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-100172.PDF), generated with kicad-footprint-generator Soldered wire connection, for 3 times.

New Pull Request