Labels Milestones
BackSOIC Pitch 1.27 SSOP-8 2.9 x2.8mm Pitch 0.65mm Slug Up (PowerSO-20) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf HSOP 11.0 x 15.9mm Pitch 0.65mm Slug Down (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf HSOP 11.0x15.9mm Pitch 1.27mm Slug Down Thermal Vias (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf HSOP 11.0.
- (https://katalog.we-online.com/em/datasheet/9775051360.pdf), generated with kicad-footprint-generator JST PHD series connector.
- [HTQFP] thermal pad LQFP.
- Http://www.vishay.com/docs/88655/kbl005.pdf Vishay KBL rectifier diode bridge DFS, see.
- On 02/06/2025 Digikey RED - worth looking into.