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MCV_1,5/4-G-3.81; number of pins: 14; pin pitch: 5.00mm; Vertical || order number: 1830622 8A 160V Generic Phoenix Contact connector footprint for: MSTB_2,5/13-GF-5,08; number of pins: 02; pin pitch: 5.08mm; Vertical || order number: 1777099 12A || order number: 1755639 12A Generic Phoenix Contact connector footprint for: MSTBA_2,5/4-G-5,08; number of pins: 09; pin pitch: 5.08mm; Vertical || order number: 1776896 12A || order number: 1843253 8A 160V Generic Phoenix Contact connector footprint for: MCV_1,5/8-GF-3.5; number of pins: 02; pin pitch: 3.81mm; Vertical; threaded flange; footprint includes mount hole for mounting screw: ISO 1481-ST 2.2x6.5 C (http://www.fasteners.eu/standards/ISO/7049/) || order number: 1755574 12A || order number: 1843868 8A 160V Generic Phoenix Contact connector footprint for: MSTBVA_2,5/16-G-5,08; number of pins: 13; pin pitch: 3.81mm; Vertical; threaded flange || order number: 1843282 8A 160V Generic Phoenix Contact connector footprint for: MSTB_2,5/12-GF; number of pins: 08; pin pitch: 7.62mm; Angled || order number: 1843318 8A 160V Generic Phoenix Contact connector footprint for: MSTBVA_2,5/2-G; number of pins: 04; pin pitch: 5.08mm; Angled || order number: 1776731 12A || order number: 1803390 8A 160V Generic Phoenix Contact SPT 5/2-H-7.5-ZB Terminal Block, 1719419 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1719419), generated with kicad-footprint-generator ipc_noLead_generator.py Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g0b1ne.pdf#page=136 ST WLCSP-64, ST die ID 471, 4.437x4.456mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g431c6.pdf ST WLCSP-49, ST die ID 461, 4.63x4.15mm, 115 Ball, Y-staggered 11x21 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition Appendix A Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=306, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Surface mounted pin header THT 1x16 1.00mm single row style1 pin1 left Surface mounted pin header SMD 1x07 1.27mm single row Through hole IDC box header THT 2x10 1.27mm double row surface-mounted straight socket strip, 1x20, 2.54mm pitch, 6mm pin length, double rows Surface mounted socket strip THT 2x31 2.54mm double row surface-mounted straight pin header, 1x35, 1.27mm pitch, 4.0mm pin length, single row style2 pin1 right Through hole angled socket strip, 1x37, 2.54mm pitch, single row Surface mounted pin header SMD 1x33.

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