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Grid, NSMD pad definition Appendix A BGA 676 1 FG676 FGG676 Spartan-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=273, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=284, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=84, NSMD pad definition Appendix A BGA 484 0.8 SB484 SBG484 SBV484 Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row style2 pin1 right Through hole angled pin header, 2x05, 2.54mm pitch, 6mm pin length, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip THT 1x32 2.00mm single row Through hole socket strip THT 1x31 2.54mm single row Through hole socket strip THT 2x15 2.00mm double row Through hole angled pin header SMD 1x33 1.27mm single row style1 pin1 left Surface mounted socket strip THT 2x03 1.27mm double row surface-mounted straight pin header, 1x02, 1.27mm pitch, double rows Through hole IDC header, 2x12, 2.00mm pitch, 4.2mm pin length, single row Through hole straight Samtec HPM power header series 3.81mm post length THT 1x02 1.00mm single row style2 pin1 right Through hole socket strip SMD.

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