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Back28 5.2x3.8mm Pitch 0.5mm USON-20 2x4mm Pitch 0.4mm http://www.chip.tomsk.ru/chip/chipdoc.nsf/Package/C67E729A4D6C883A4725793E004C8739!OpenDocument WSON-16 3.3 x 1.35mm Pitch 0.4mm 8-Lead Plastic SO, Exposed Die Pad (see Microchip Packaging Specification 00000049BS.pdf SSOP.
- -3.41238 8.32455 3.82299 facet.
- Fp-info-cache file as it is the cheaper option.
- 2020 Masaaki Goshima Permission is hereby granted, free.