Labels Milestones
Back1 FF900 FFG900 FFV900 FF901 FFG901 FFV901 Artix-7, Kintex-7 and Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=269, NSMD pad definition Appendix A BGA 484 1 FG484 FGG484 Artix-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=279, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments EUW 7 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils), SMDSocket, LongPads 32-lead dip package, row spacing 7.62 mm (300 mils), LongPads 6-lead though-hole mounted DIP package, row.
- Thorlabs photodiodes TO-46-3, Pin2 at center of hole.
- = 1.8*1; PI=3.14159265*1; KnobMajorRadius = KnobDiameter/2; KnobMinorRadius.
- Normal -0.0994897 5.35951e-05 0.995039 vertex 8.1846.
- 0.0992563 vertex -4.25779 9.04827 0 facet normal -3.886841e-001.