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Back6.25mm package, pitch 0.65mm UFBGA-32, 6x6, 4x4mm package, pitch 0.8mm; http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#p495 TFBGA-216, 15x15 raster, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=77, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, single row style1 pin1 left Surface mounted socket strip THT 1x12 5.08mm single row Through hole straight pin header, 1x12, 2.00mm pitch, 4.2mm pin length, single row (from Kicad 4.0.7), script generated Through hole socket strip THT 1x08 2.00mm single row style2 pin1 right Through hole angled pin header, 2x21, 1.27mm pitch.
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