Labels Milestones
Back2.54mm 8.89mm 350mil SMDSocket LongPads 4-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 40-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils 22-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket 24-lead though-hole mounted high-volatge DIP package (based on http://www.latticesemi.com/view_document?document_id=213 BGA 0.8mm 9mm 121 BGA-132 11x17 12x18mm 1.0pitch Altera BGA-144 M144 MBGA Altera VBGA.
- Push-pull (https://media.digikey.com/PDF/Data%20Sheets/Hirose%20PDFs/DM3D-SF.pdf 1.10mm Pitch microSD Memory.
- 8 1EP ThermalVias WSON, 8 Pin (https://www.winsen-sensor.com/d/files/me2/mems--gm-402b--manual-v1_1.pdf.
- 2015-03-24 12:20:47 -07:00 55ee65a5e9 Go to file b11a8d3187.