Labels Milestones
BackWLCSP-156, ST die ID 494, 3.3x3.38mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb15cc.pdf#page=119 ST WLCSP-52, ST die ID 460, 2.3x2.48mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition Appendix A BGA 324 0.8 CS324 CSG324 BGA 324 0.8 CS324 CSG324 BGA 324 0.8 GateMate FPGA Maxim WLP-12, W121H2+1, 2.008x1.608mm, 12 Ball, 3x4 Layout, 0.5mm Pitch.
- WAGO 236-204, 45Degree (cable.
- WAGO 804-109 45Degree pitch.
- Fixation 2,5mm Drill, Soldering, Fischer SK104-STC-STIC.
- 3x3 area grid, YZF, YZF0016, 2.39x2.39mm, 16.