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IP57, XENSIV, LGA-5, https://www.infineon.com/dgdl/Infineon-IM73A135-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c7f2a768a017fadec36b84500 MEMS Microphone LGA Dust Water TDK InvenSense MEMS I2S SPH0645LM4H Knowles Sensirion, SHT40, SHT41, SHT45, DFN, 4 Pin (http://www.vishay.com/docs/83510/tcmt1100.pdf), generated with kicad-footprint-generator JST PUD series connector, 502585-0770 (http://www.molex.com/pdm_docs/sd/5025850270_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Texas SIL0010A MicroSiP, 10 Pin (http://www.ti.com/lit/ds/symlink/tps7a91.pdf#page=30), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.3mm, height 7, Wuerth electronics 9774070243 (https://katalog.we-online.de/em/datasheet/9774070243.pdf), generated with kicad-footprint-generator JST SUR series connector, S8B-XH-A (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 54722-0604, 60 Pins per row (http://suddendocs.samtec.com/prints/lshm-1xx-xx.x-x-dv-a-x-x-tr-footprint.pdf), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0180, 18 Circuits (https://www.molex.com/pdm_docs/sd/2005280180_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=280), generated with kicad-footprint-generator ipc_noLead_generator.py 72-Lead Frame Chip Scale Package LFCSP (5mm x 4mm) (see Linear Technology DFN_8_05-08-1702.pdf 8-Lead Plastic Small Outline (SO) (http://www.everlight.com/file/ProductFile/201407061745083848.pdf 5-Lead Plastic Small Outline No-Lead 8-Lead Plastic DFN (2mm x 2mm) (see Linear Technology DFN_32_05-08-1734.pdf DFN44 8.9x5, 0.4P; CASE 506BU-01 (see ON Semiconductor 932BB.PDF 144-Lead Plastic Thin Quad Flat, No Lead Package, 1.2x1.8x1.55 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 48-Lead Thin Quad Flat, No Lead Package (MA) - 2x2x0.9 mm Body [SOIC] (https://docs.broadcom.com/docs/AV02-0169EN SOIC 1.27 16 12 Wide 16-Lead Plastic DFN (5mm x 3mm) (see Linear Technology DFN_32_05-08-1734.pdf DFN44 8.9x5, 0.4P; CASE 506BU-01 (see ON Semiconductor 932BH.PDF TQFP, 64 Pin (JEDEC MO-153 Var.

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