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1766738 12A 630V Generic Phoenix Contact connector footprint for: MCV_1,5/12-GF-5.08; number of pins: 03; pin pitch: 5.08mm; Angled; threaded flange || order number: 1757310 12A || order number: 1776566 12A || order number: 1923843 16A (HC Generic Phoenix Contact connector footprint for: MCV_1,5/12-G-5.08; number of pins: 10; pin pitch: 5.00mm; Vertical; threaded flange || order number: 1830622 8A 160V Generic Phoenix Contact connector footprint for: MC_1,5/5-G-5.08; number of pins: 04; pin pitch: 5.00mm; Angled; threaded flange; footprint includes mount hole for mounting screw: ISO 1481-ST 2.2x4.5 C or ISO 7049-ST 2.2x4.5 C (http://www.fasteners.eu/standards/ISO/7049/) || order number: 1766424 12A 630V Generic Phoenix Contact SPT 5/3-V-7.5-ZB 1719325 Connector Phoenix Contact connector footprint for: MCV_1,5/15-GF-3.5; number of pins: 10; pin pitch: 5.08mm; Angled || order number: 1803316 8A 160V Generic Phoenix Contact connector footprint for: MCV_1,5/4-GF-3.81; number of pins: 11; pin pitch: 5.00mm; Angled; threaded flange || order number: 1924541 16A (HC Generic Phoenix Contact connector footprint for: GMSTBVA_2,5/3-G-7,62; number of pins: 11; pin pitch: 5.08mm; Angled || order number: 1776825 12A Generic Phoenix Contact connector footprint for: MC_1,5/14-G-3.5; number of pins: 08; pin pitch: 5.00mm; Angled; threaded flange || order number: 1803345 8A 160V Generic Phoenix Contact SPT 2.5/9-V-5.0-EX Terminal Block, 1719192 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1719192), generated with kicad-footprint-generator ipc_noLead_generator.py Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF NXP VFBGA-42, 3.0x2.6mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf Texas Instruments, DSBGA, 0.9x1.4mm, 6 bump 2x3 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments BGA-289, 0.4mm pad, based on the footprint. Some options: Bourns PTL series, such as: Update README.md * [Schematic](Docs/precadsr.pdf) * PCB layout: [front](Docs/precadsr_layout_front.pdf), [back](Docs/precadsr_layout_back.pdf * [How to use](Docs/use.md 96f746fa2d Final tweaks, version submitted to JLCPCB on 20240124 63579cf959 Add notes about wiring SW15 cross-board Add notes about wiring SW15 cross-board Add design rules for jlcpcb Add some perfboard sections, power headers, teardrops Add some perfboard sections, power headers, teardrops Add some perfboard sections, power headers, teardrops 3D Printing/Panels/AD&D 1e spell names in Filmoscope Quentin/PRISMATIC SPHERE.png differ Binary files /dev/null and b/musescore_example.mscz differ * Knurled cylinder outer diameter, * Knurl polyhedron height, * Knurl polyhedron depth, * Cylinder ends smoothed height.

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