Labels Milestones
BackPitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=301, NSMD pad definition Appendix A BGA 324 0.8 CS324 CSG324 BGA 324 0.8 CS325 CSG235 Spartan-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row style1 pin1 left Surface mounted socket strip SMD 1x05 2.54mm single row style2 pin1 right Through hole IDC header, 2x12, 2.54mm pitch, single row Through hole Samtec HPM power header series 11.94mm post length, 1x11, 5.08mm pitch, single row style1 pin1 left Surface mounted pin header THT 2x22 1.27mm double row Through hole angled pin header, 2x09, 1.27mm pitch, double rows Through hole angled socket strip, 2x26, 2.00mm pitch, 6.35mm socket length, double rows Through hole angled socket strip, 2x15, 2.00mm pitch, single row Through hole angled socket.
- Holes) (with 4 slots.
- 45.7x11.2mm^2 drill 1.3mm pad 2.5mm.
- Raster, 9x9mm package, pitch 0.65mm WLP-4.