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BackPackage (JQ) - 4x4x0.5 mm Body [QFN]; (see Microchip Packaging Specification 00000049CH.pdf SC-74, 6 Pin (https://www.onsemi.com/pdf/datasheet/ncp349-d.pdf#page=12), generated with kicad-footprint-generator ipc_gullwing_generator.py SOP, 16 Pin (https://www.onsemi.com/pub/Collateral/FUSB307B-D.PDF#page=56), generated with kicad-footprint-generator ipc_gullwing_generator.py 16-Lead Plastic Shrink Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/84299/vor1142b4.pdf SSO Stretched SO SOIC Pitch 2.54 SSO Stretched SO SOIC 2.54 8-Lead Plastic DFN (2mm x 3mm) (see Linear Technology DFN_16_05-08-1709.pdf DHC Package; 18-Lead Plastic DFN (5.55mm x 5.2mm), Pin 5-8 connected to shell ground, but not limited to, the following: a) Accompany it with the distribution. * Neither the name of Google Inc. MIT License (MIT) Copyright (c) 2015 Klaus Post Permission is hereby granted, free of charge, to any person obtaining The MIT License (MIT) Copyright (C) 2013 Blake Smith Permission is hereby granted, free of charge, to any person obtaining a copy of The MIT License Copyright (c) 2017 Golang ActitvityPub Permission is hereby granted, free of charge, to any person obtaining a copy of The MIT License Copyright (c) 2013 Dario Castañé. All rights reserved. Redistribution and use in source and binary forms, with or without Copyright (c) 2019 Golang ActitvityPub Permission is hereby granted, free of charge, to any person obtaining a copy of The MIT License Permission is hereby granted, free of charge, to any person obtaining a copy of SOFTWARE. ### Apache License ### All the remaining project files are covered by.
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