Labels Milestones
BackAnalog BGA-49, 6.25x6.25mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf ST WLCSP-18, ST Die ID 466, 1.86x2.14mm, 18 Ball, X-staggered 21x11 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g051f8.pdf#page=102 ST WLCSP-25, ST die ID 456, 1.94x2.4mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double rows Through hole socket strip SMD 1x23 2.54mm single row (from Kicad 4.0.7), script generated Through hole angled pin header THT 1x28 1.27mm single row Through hole straight pin header, 2x19, 2.54mm pitch, 8.51mm socket length, single row Through hole straight socket strip, 2x11, 2.00mm pitch, 4.2mm pin length, double rows Through hole straight socket strip, 2x13, 2.54mm pitch, 6mm pin length, double rows Surface mounted pin header SMD 1x28.
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