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Size 36x8.3mm^2, drill diamater 1.2mm, pad diameter 2mm, outer diameter 4.4mm, size source Multi-Contact FLEXI-E 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Hirose DF63 through hole, DF11-22DP-2DSA, 11 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Capacitor SMD Kemet-E (7360-38 Metric), IPC_7351 nominal, (Body size from: http://datasheets.avx.com/F72-F75.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole PLCC, 52 pins, surface mount PLCC, 28 pins, through hole M2, height 3.5, Wuerth electronics 97730256330 (https://katalog.we-online.com/em/datasheet/97730256330R.pdf), generated with kicad-footprint-generator Soldered wire connection, for 5 times 0.75 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 3mm, size source Multi-Contact FLEXI-E 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Samtec HLE .100.

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