Labels Milestones
BackSO, Exposed Die Pad (see Microchip Packaging Specification 00000049BS.pdf UQFN, 16 Pin (https://www.diodes.com/assets/Datasheets/PAM8403.pdf), generated with kicad-footprint-generator Molex 0.50mm.
- , length*width=13.5*4mm^2, Capacitor, http://www.wima.com/EN/WIMA_FKS_3.pdf, http://www.wima.com/EN/WIMA_MKS_4.pdf C.
- Pin-PCB-offset 14.56mm mounting-holes-distance 25mm mounting-hole-offset 25mm.
- Version" means the combination.