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1836370 8A 320V Generic Phoenix Contact connector footprint for: MCV_1,5/12-G-5.08; number of pins: 04; pin pitch: 3.50mm; Angled; threaded flange || order number: 1924334 16A (HC Generic Phoenix Contact connector footprint for: MC_1,5/3-GF-5.08; number of pins: 04; pin pitch: 5.08mm; Angled; threaded flange || order number: 1776537 12A || order number: 1806229 12A 630V Generic Phoenix Contact connector footprint for: GMSTBV_2,5/7-GF-7,62; number of pins: 05; pin pitch: 3.50mm; Angled; threaded flange || order number: 1843347 8A 160V Generic Phoenix Contact connector footprint for: MSTBV_2,5/3-GF-5,08; number of pins: 06; pin pitch: 3.81mm; Vertical; threaded flange || order number: 1766440 12A 630V Generic Phoenix Contact connector footprint for: MSTB_2,5/5-GF; number of pins: 09; pin pitch: 3.81mm; Angled; threaded flange; footprint includes mount hole for mounting screw: ISO 1481-ST 2.2x6.5 C (http://www.fasteners.eu/standards/ISO/7049/) || order number: 1806287 12A 630V Generic Phoenix Contact connector footprint for: MC_1,5/9-G-5.08; number of pins: 10; pin pitch: 5.08mm; Vertical; threaded flange || order number: 1776015 12A Generic Phoenix Contact SPT 1.5/11-H-3.5 Terminal Block, 1990805 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1990805), generated with kicad-footprint-generator ipc_noLead_generator.py Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g491re.pdf ST WLCSP-81, ST die ID 461, 4.63x4.15mm, 115 Ball, Y-staggered 11x21 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h725vg.pdf ST WLCSP-115, ST die ID 467, 3.09x3.15mm, 52 Ball, X-staggered 13x8 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g491re.pdf ST WLCSP-81, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 21x11 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb15cc.pdf#page=119 ST WLCSP-52, ST die ID 468, 3.15x3.13mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g491re.pdf ST WLCSP-81, ST die ID 469, 4.02x4.27mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g051f8.pdf#page=102 ST WLCSP-25, ST die ID 456, 1.94x2.4mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g051f8.pdf#page=102 ST WLCSP-25, ST die ID 494, 3.3x3.38mm, 49 Ball, 7x7 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST TFBGA-361, 12.0x12.0mm, 361 Ball, 23x23 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wl54jc.pdf ST UFBGA-121, 6.0x6.0mm, 121 Ball, 11x11 Layout, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf WSON 8 1EP ThermalVias WSON, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/4440fb.pdf#page=13), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 28 Pin (JEDEC MO-153 Var.

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