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Ground Terminal, without Boss Ultra-small-sized Tactile Switch for High-Density Packaging with Ground Terminal, with Boss Ultra-small-sized Tactile Switch SPST Slide 7.62mm 300mil LowProfile 1x-dip-switch SPST Copal_CVS-01xB, Slide, row spacing 7.62 mm (300 mils), Socket THT DIP DIL PDIP 2.54mm 7.62mm 300mil 8-lead dip package, row spacing 11.48 mm (451 mils 22-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 16-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 7x-dip-switch SPST KingTek_DSHP07TJ, Slide, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 28-lead though-hole mounted DIP package, row spacing 16.51 mm.

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