Labels Milestones

Back

Package (MS) [MSOP], variant of 8-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 20-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads 12-lead though-hole mounted DIP package.

• 1.3375 (end 3.75 0 (end -0.261252.
• 0.949055 (end 0.786375 -1.753625 (end.
• 2 times 0.75 mm².

New Pull Request

0 Open 0 Closed

Label

Show archived labels

Use alt + click/enter to exclude labels

All labels No label

Milestone

All milestones No milestones

Project

All projects No project

0 Open 0 Closed

Close

Label

Clear labels

Milestone

No milestone

Projects

Clear projects