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12-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 18-lead surface-mounted (SMD) DIP package, row spacing.

• Series https://support.epson.biz/td/api/doc_check.php?dl=brief_fa-238v_en.pdf, 3.2x2.5mm^2 package crystal Epson.
• 1; //right_rib_x = width_mm - 9.5/2 .
• Size 42.7x7mm^2 drill 1.2mm pad.
• -0.0376856 0.923218 vertex 7.60195.

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