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BackSSOP28: plastic shrink small outline package; 28 leads; body width 3.9 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot510-1_po.pdf TSSOP, 44 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/2512S.pdf#page=17), generated with kicad-footprint-generator JST ZE series connector, 502443-0470 (http://www.molex.com/pdm_docs/sd/5024430270_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py MSOP, 16 Pin (http://www.st.com/resource/en/datasheet/l3gd20.pdf), generated with kicad-footprint-generator Mounting.
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