Labels Milestones
BackStrip, HLE-117-02-xxx-DV-A, 17 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP8: plastic thin shrink small outline package; 10 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf SSOP20: plastic shrink small outline package; 28 leads; body width 6.1 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot369-1_po.pdf SSOP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ri_soic_ic/ri_16_1.pdf), generated with.
- Vertex -9.99456 -1.98804 2.19603 facet.
- -0.286094 0.952737 0.102192 facet normal.
- Package length=7.0mm, package width=2.5mm, 3 pins.
- 4.5x7mm (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-20-71/ Infineon SO package 20pin.