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15, Wuerth electronics 9775086960 (https://katalog.we-online.com/em/datasheet/9775086960.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-117-02-xx-DV-TE, 17 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST PH series connector, 502494-0470 (http://www.molex.com/pdm_docs/sd/5024940270_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M3, height 10, Wuerth electronics 9775076960 (https://katalog.we-online.com/em/datasheet/9775076960.pdf), generated with kicad-footprint-generator JST XH series connector, 14110213002xxx (https://b2b.harting.com/files/download/PRD/PDF_TS/1411XX13002XXX_100228421DRW035C.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M2, height 4, Wuerth electronics 9774020633 (https://katalog.we-online.com/em/datasheet/9774020633.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SSOP18: plastic shrink small outline package; 28 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP sot054_po.pdf TO-92 2-pin variant by Heraeus, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf HTSSOP, 38 Pin (JEDEC MO-153 Var DD https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 24 Pin (http://www.ti.com/lit/ds/symlink/pca9548a.pdf#page=37), generated with kicad-footprint-generator Diode SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size from: http://datasheets.avx.com/NOS.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DFN8 2x2, 0.5P (https://www.onsemi.com/pub/Collateral/511AT.PDF On Semiconductor, SIP-38, 9x7mm, (https://www.onsemi.com/pub/Collateral/AX-SIP-SFEU-D.PDF#page=19 8-Lead Plastic Dual Flat, No Lead Package (MR) - 9x9x0.9 mm Body with Exposed Pad Variation; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot190-1_po.pdf VSSOP-8 2.3x2mm Pitch 0.5mm Fairchild-specific MicroPak2-6 1.0x1.0mm Pitch 0.35mm HVSON, 8 Pin (https://www.monolithicpower.com/en/documentview/productdocument/index/version/2/document_type/Datasheet/lang/en/sku/MP2303A/document_id/494#page=14), generated with kicad-footprint-generator Molex Mini-Fit Jr.

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