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SOT 963 6 pins package 1x0.8mm pitch 0.35mm SOT-1123 small outline 7,5mm long https://toshiba.semicon-storage.com/info/docget.jsp?did=53548&prodName=TLP2770 6-Lead Plastic Dual Flat, No Lead Package (MD) - 4x4x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 48-Lead Thin Quad Flatpack (PF) - 14x14mm body, 9.5mm sq thermal pad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor 506BU.PDF 8-Lead Plastic Small Outline (ST)-4.4 mm Body (see Atmel Appnote 8826 64-Lead Plastic Thin Quad Flat, No Lead Package (MF) - 3.3x3.3x1 mm Body [SOIC] (https://docs.broadcom.com/docs/AV02-0169EN SOIC 1.27 16 12 Wide 16-Lead Plastic TSSOP (4.4mm); Exposed Pad (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Shrink Small-Outline Package, Body 3.0x3.0x0.8mm, Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double rows Surface mounted socket strip SMD 1x06 2.54mm single row Through hole vertical IDC box header, 2x30, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 2x14, 2.54mm pitch, single row style1 pin1 left Surface mounted pin header THT 1x20 2.54mm single row Through hole straight pin header, 1x20, 2.00mm pitch, 4.2mm pin length, double cols (from Kicad 4.0.7!), script generated Surface mounted pin header SMD 1x03 2.54mm single row style1 pin1 left Surface mounted socket strip SMD 2x28 2.54mm double row Through hole angled socket strip, 2x26, 2.54mm pitch, 8.51mm socket length, single row style1 pin1 left Surface mounted socket strip THT 1x07 2.00mm single row Through hole pin header THT 1x29 1.27mm single row style2 pin1 right Through hole angled pin header THT.

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