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Surface-mounted straight pin header, 2x34, 2.00mm pitch, single row (from Kicad 4.0.7), script generated Through hole angled pin header, 1x30, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 9.5mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled pin header, 2x09, 2.54mm pitch, 6mm pin length, double rows Through hole angled socket strip THT 2x04 1.27mm double row Through hole straight pin header, 1x10, 1.27mm pitch, single row Through hole angled pin header THT 2x03 2.00mm double row Through hole straight pin header, 1x15, 2.54mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Surface mounted socket strip THT 1x32 1.00mm single row style2 pin1 right Through hole angled pin header THT 2x34 1.27mm double row Through hole straight socket strip, 2x16, 2.00mm pitch, 6.35mm socket length, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 2x29, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip THT 1x24 2.54mm single row Through hole pin header SMD 2x09 2.00mm double row Through hole IDC box header 2x30 2.54mm double row surface-mounted straight pin header, 1x33, 2.00mm pitch, single row Surface mounted socket strip SMD 2x19 1.00mm double row Through hole angled socket strip SMD 2x22 1.00mm double row Through hole angled pin header THT 1x18 1.00mm single row Through hole angled socket strip, 2x34, 2.00mm pitch, 4.2mm pin length, single row Through hole pin header, 2x23, 1.27mm pitch, 3.9x4.9mm body, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments DSBGA BGA Texas Instruments, DSBGA-6, 0.704x1.054mm, NSMD, YKA pad definition, 1.468x0.705mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g051f8.pdf#page=102 ST WLCSP-25, ST die ID 460, 2.3x2.48mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments DSBGA BGA YZP R-XBGA-N6 Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 (perimeter) array, NSMD pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=95, NSMD pad definition Appendix A Artix-7 BGA, 19x19 grid, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition Appendix A BGA 1156.

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