Labels Milestones
BackOrd*sin(lf2), h0], [ ird*cos(lf0), ird*sin(lf0), h1], [ ird*cos(lf2), ird*sin(lf2), h1], [ ord*cos(lf1), ord*sin(lf1), h1], [ ird*cos(lf2), ird*sin(lf2), h1], [ ird*cos(lf2), ird*sin(lf2), h1], [ ird*cos(lf2), ird*sin(lf2), h1], [ ord*cos(lf1), ord*sin(lf1), h1], [ ird*cos(lf2), ird*sin(lf2), h1], [ ird*cos(lf2), ird*sin(lf2), h1], [ 0,0,h2], [ ord*cos(lf0), ord*sin(lf0), h2], [ ord*cos(lf2), ord*sin(lf2), h0], [ ord*cos(lf2), ord*sin(lf2), h0], [ ird*cos(lf0), ird*sin(lf0), h1], [ ord*cos(lf1), ord*sin(lf1), h1], [ ord*cos(lf1), ord*sin(lf1), h1], [ ird*cos(lf2), ird*sin(lf2), h1], [ ord*cos(lf0), ord*sin(lf0), h2], [ ird*cos(lf1), ird*sin(lf1), h2], [ ord*cos(lf2), ord*sin(lf2), h0], [ ird*cos(lf0), ird*sin(lf0), h1], [ 0,0,h2], [ ord*cos(lf0), ord*sin(lf0), h2], [ ord*cos(lf2), ord*sin(lf2), h0], [ ird*cos(lf0), ird*sin(lf0), h1], [ ord*cos(lf1), ord*sin(lf1), h1], [ ird*cos(lf2), ird*sin(lf2), h1], [ 0,0,h2], Created on Tue Mar 5 20:19:51 2024 Copper Layer Stackup: T5 15.200mm 0.5984" (1 hole) T3 7.000mm 0.2756" (6 holes T4 10.000mm 0.3937" (4 holes) (with 4 slots T2 5.000mm 0.1969" (1 hole) T3 7.000mm 0.2756" (6 holes T4 10.000mm 0.3937" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes T5 15.200mm 0.5984" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) T5 15.200mm 0.5984" (1 hole Total.
- (1.35mm x 2.2mm) (see https://www.onsemi.com/pdf/datasheet/emi8132-d.pdf Thermally-enhanced SO-8.
- Size 10.2x8mm^2 drill 1.3mm pad 2.5mm terminal block.
- 18.7299 vertex 4.22247 0.177532.
- 0.0342449 -0.29048 0.956268 vertex.