Labels Milestones
Back6-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 10-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 48-lead surface-mounted (SMD) DIP package, row spacing 5.08mm, pin-spacing 2.54mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-2 Vertical RM 1.7mm Pentawatt Multiwatt-5 staggered type-1 TO-220F-9, Vertical, RM 5.45mm, , see http://www.onsemi.com/pub/Collateral/340AC.PDF TO-3PB-3 Horizontal RM 4.58mm IPAK TO-251-3, Horizontal, RM 2.286mm SIPAK Vertical RM 1.27mm staggered type-2.
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