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2.54mm 10.16mm 400mil Socket 3M 24-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils), LongPads 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 18-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 24-lead though-hole mounted DIP package, row spacing 5.08mm, pin-spacing 2.54mm, see http://www.st.com/resource/en/datasheet/stp20nm60.pdf TO-220F-3 Horizontal RM 3.81mm TO-264-5, Vertical, RM 1.27mm, Multiwatt-7, staggered type-2 TO-220-9 Horizontal RM 2.29mm IPAK TO-262-3, Horizontal, RM 1.27mm, Multiwatt-7, staggered type-1 TO-220F-2, Horizontal, RM 10.9mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-3 Horizontal RM 5.08mm TO-220-2, Vertical, RM 1.27mm, Multiwatt-7, staggered type-2 TO-220-7 Horizontal RM 1.7mm IIPAK I2PAK TO-262-3, Vertical, RM 1.7mm, PentawattF-, MultiwattF-5, staggered type-2 TO-220F-7 Vertical RM 2.54mm IIPAK I2PAK TO-262-5, Vertical, RM 1.27mm, MultiwattF-15, staggered type-1 TO-220-7, Horizontal, RM 1.27mm, Multiwatt-7, staggered type-1 TO-220-7, Horizontal, RM 1.7mm, Pentawatt, Multiwatt-5, staggered type-2, see http://www.st.com/resource/en/datasheet/l298.pdf TO-220-15 Vertical RM 1.27mm staggered type-2 TO-220-4 Vertical RM 1.7mm IIPAK I2PAK TO-262-5, Horizontal, RM 5.08mm, see https://www.diodes.com/assets/Package-Files/TO126.pdf TO-126-2 Vertical RM 5.08mm TO-220-3, Horizontal, RM 1.27mm, MultiwattF-15, staggered type-2 TO-220-9 Vertical 2.54mm Pitch Multiwatt 8 TO-220-9, Vertical, RM 1.7mm, staggered type-1, see https://www.njr.com/semicon/PDF/package/TO-220F-4_E.pdf TO-220F-4 Horizontal RM 5.475mm SOT-93 TO-218-3, Vertical, RM 1.7mm, PentawattF-, MultiwattF-5 TO-220F-5 Vertical RM 5.08mm TO-220-3, Horizontal, RM 1.27mm, staggered type-2, see http://www.st.com/resource/en/datasheet/tda7391lv.pdf TO-220-11 Horizontal RM 1.7mm PentawattF- MultiwattF-5 staggered type-1 TO-220-11, Horizontal, RM 2.54mm, IIPAK, I2PAK, see http://pdf.datasheetcatalog.com/datasheet/irf/iris4011.pdf TO-262-5 Vertical RM 1.27mm Multiwatt-7 staggered type-2 TO-220-15, Vertical, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 5.08mm 7.62mm 300mil 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x6.64mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 3x-dip-switch SPST Copal_CVS-03xB, Slide, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 16-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 48-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils Analog BGA-28 4.0mm x 6.25mm package, pitch 0.65mm VFBGA-86, 6.0x6.0mm, 86 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l412t8.pdf ST WLCSP-49, off-center ball grid, ST die ID 460, 2.3x2.48mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l496wg.pdf ST WLCSP-132, ST die ID 480, 4.57x4.37mm, 132 Ball, 12x11 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, DSBGA, area grid, YZT, 1.86x1.36mm, 12 Ball, 4x3 Layout, 0.4mm Pitch, http://www.st.com/content/ccc/resource/technical/document/technical_note/92/30/3c/a1/4c/bb/43/6f/DM00103228.pdf/files/DM00103228.pdf/jcr:content/translations/en.DM00103228.pdf pSemi CSP-16 1.64x2.04x0.285mm (http://www.psemi.com/pdf/datasheets/pe29101ds.pdf, http://www.psemi.com/pdf/app_notes/an77.pdf UFD Package, 4-Lead Plastic Stretched Small Outline (SO) (http://www.everlight.com/file/ProductFile/201407061745083848.pdf 5-Lead Plastic Small.

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