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Ball grid, ST die ID 483, 3.73x4.15mm, 115 Ball, X-staggered 7x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g051f8.pdf#page=102 ST WLCSP-25, ST die ID 494, 3.3x3.38mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g071eb.pdf ST WLCSP-36, ST die ID 464, 2.58x3.07mm, 36 Ball, 6x6 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row Through hole socket strip SMD 1x12 2.00mm single row Through hole pin header THT 2x09 1.27mm double row Through hole angled socket strip, 2x47, 1.27mm pitch, single row Surface mounted pin header SMD 1x08 2.00mm single row Surface mounted pin header THT 2x34 2.00mm double row Through hole socket strip THT 1x02 1.00mm single row Through hole angled pin header THT 1x01 2.54mm single row style2 pin1 right Through hole Samtec HPM power header series 11.94mm post length THT 1x05 1.00mm single row Surface mounted socket strip THT 1x05 2.54mm single row style1 pin1 left Surface mounted socket strip THT 2x13 2.00mm double row Through hole vertical IDC box header, 2x07, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 2x21 1.00mm double row surface-mounted straight socket strip, 2x29, 1.00mm pitch, 2.0mm pin.

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