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TO-220-15, Vertical, RM 1.27mm, staggered type-1 TO-220-9, Horizontal, RM 2.54mm IIPAK I2PAK TO-262-5, Horizontal, RM 1.7mm, PentawattF-, MultiwattF-5 TO-220F-5 Vertical RM 5.45mm TO-264-5, Horizontal, RM 2.54mm, see https://www.vishay.com/docs/66542/to-220-1.pdf TO-220-3 Vertical RM 2.54mm TO-247-5, Vertical, RM 1.7mm, staggered type-1, see http://www.ti.com/lit/ds/symlink/lmd18200.pdf TO-220-15, Vertical, RM 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Horizontal RM 5.45mm TO-264-5, Horizontal, RM 10.9mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-4 Horizontal RM 2.54mm staggered type-1 TO-220-5, Horizontal, RM 1.7mm, Pentawatt, Multiwatt-5, staggered type-2, see http://www.st.com/resource/en/datasheet/tda7391lv.pdf TO-220-11 Vertical RM 1.7mm IIPAK I2PAK TO-262-3, Vertical, RM 2.54mm, staggered type-1 TO-220F-5 Vertical RM 1.7mm PentawattF- MultiwattF-5 TO-220F-5, Vertical, RM 3.81mm, see https://www.onsemi.com/pub/Collateral/NJL3281D-D.PDF TO-264-5 Vertical RM 2.54mm TO-220-4, Horizontal, RM 1.7mm, PentawattF-, MultiwattF-5 TO-220F-5 Vertical RM 5.08mm TO-220-3, Horizontal, RM 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Vertical RM 0.9mm staggered type-2 TO-220-11, Horizontal, RM 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Horizontal RM 5.08mm TO-220F-3, Horizontal, RM 1.27mm, Multiwatt-7, staggered type-1 TO-220F-7 Vertical RM 2.54mm TO-220F-4, Horizontal, RM 2.54mm, staggered type-1 TO-220-4, Vertical, RM 1.7mm, PentawattF-, MultiwattF-5, staggered type-2 TO-220-7, Horizontal, RM 2.54mm, staggered type-1 TO-220-11, Horizontal, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 5.08mm 7.62mm 300mil Socket LongPads 22-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 6-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 20-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 10.8x26.96mm 10x-dip-switch SPST , Slide, row spacing 11.43 mm (450 mils), SMDSocket, SmallPads 14-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 28-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 8-Lead, 300\" Wide, Surface Mount Package (https://www.fairchildsemi.com/package-drawings/ML/MLSOP08A.pdf Power Integrations variant of 8-Lead Plastic Dual Flat, No Lead Package, 1.2x1.8x1.55 mm Body [VSON] http://www.ti.com/lit/ds/symlink/csd87334q3d.pdf VSON, 10 Pin (http://www.ti.com/lit/gpn/tps63030#page=24), generated with kicad-footprint-generator connector JST J2100 series connector, 14110713010xxx (https://b2b.harting.com/files/download/PRD/PDF_TS/1411XX13010XXX_100228421DRW063C.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 10-Lead Plastic Dual Flat, No Lead Package (MF) - 6x5 mm Body [DFN] (see Microchip.

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