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ST WLCSP-100, off-center ball grid, ST die ID 456, 1.94x2.4mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u575og.pdf#page=306 ST WLCSP-100, ST die ID 494.

• 2.757875e-001 9.482119e-001 vertex -2.771161e+000 -3.256703e+000 2.494118e+001 facet.
• Socket 64-lead though-hole mounted DIP package, row spacing.

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