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Https://www.jae.com/en/connectors/series/detail/product/id=91780 USB C Type-C Receptacle Hybrid CNCTech C-ARA1-AK51X USB Type C, right-angle, SMT, https://datasheet.lcsc.com/lcsc/2204071530_G-Switch-GT-USB-7010ASV_C2988369.pdf USB Type C, Right Angle, Surface Mount, ZIF, Bottom Contact FFC/FPC, 200528-0080, 8 Circuits (https://www.molex.com/pdm_docs/sd/2005280080_sd.pdf), generated with kicad-footprint-generator JST SH series connector, B2B-EH-A (http://www.jst-mfg.com/product/pdf/eng/eEH.pdf), generated with kicad-footprint-generator connector JST SHL series connector, B8B-EH-A (http://www.jst-mfg.com/product/pdf/eng/eEH.pdf), generated with kicad-footprint-generator JST SH series connector, B16B-PUDSS (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 1-way, 2.8mm lightpipe, 10mm lens output height, 17mm protrusion, https://www.bivar.com/parts_content/Datasheets/RLP1-XXX-XXX.pdf planar light pipe 4 way 3mm PLCC-2 PLCC-4 ambient light sensor, i2c interface, 6-pin chipled package, http://optoelectronics.liteon.com/upload/download/DS86-2013-0004/LTR-303ALS-01_DS_V1.pdf Optoisolator with LED and photoresistor 3 Lead Plastic Package OnSemi CASE 100CY, light-direction upwards, see http://www.onsemi.com/pub/Collateral/QRE1113-D.PDF PhotoDiode, plastic DIL, 4.3x4.65mm², RM5.08 PhotoDiode plastic SMD DIL, 4.5x4mm² PhotoDiode plastic DIL RM5.08 PhotoTransistor, sidelooker package, RM2.54 PhotoTransistor sidelooker package RM2.54 package for diode bridges, row spacing 7.62 mm (300 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 8.89mm 350mil SMDSocket LongPads 42-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 20-lead surface-mounted (SMD) DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 40-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), body size 6.7x11.72mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 1x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils THT DIP DIL PDIP 2.54mm 25.4mm 1000mil SMDSocket SmallPads 4-lead though-hole mounted DIP package, row spacing 5.08mm, pin-spacing 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Vertical RM 1.27mm MultiwattF-15 staggered type-1 TO-220-11, Vertical, RM 5.45mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-2 Horizontal RM 5.45mm TO-247-3, Vertical, RM 1.7mm, staggered type-1, see http://www.st.com/resource/en/datasheet/tda7391lv.pdf.

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