3
1
Back

Package, 1.2x1.8x1.55 mm Body (http://www.ti.com/lit/ml/msop002a/msop002a.pdf SOIC, 16 Pin (JEDEC MO-153 Var CA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_gullwing_generator.py SO, 14 Pin (http://www.st.com/resource/en/datasheet/lsm6ds3.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 14 Pin (https://www.st.com/resource/en/datasheet/l6491.pdf), generated.

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