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YZP R-XBGA-N6 Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (area) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row (from Kicad 4.0.7), script generated Through hole angled socket strip THT 1x03 1.27mm single row Surface mounted pin header THT 1x21 2.00mm single row (from Kicad 4.0.7), script generated Through hole angled pin header THT 1x22 2.00mm single row style1 pin1 left Surface mounted pin header SMD 1x10 2.00mm single row style2 pin1 right Through hole socket strip THT 1x24 2.54mm single row style2 pin1 right Through hole angled pin header THT 1x31 2.00mm single row Through hole.

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