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3mm MLF - 3x3x0.85 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf DCB Package 8-Lead Plastic DFN (5mm x 3mm) (see Linear Technology 05081955_0_DHC18.pdf DHD Package; 18-Lead Plastic DFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic DFN (6mm x 5mm) (see http://www.everspin.com/file/236/download DFN8 2x2, 0.5P; No exposed pad (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-20-85/ Infineon SO package 20pin, exposed pad (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-20-87/ 12-Lead Plastic DFN (2mm x 2mm) 0.40mm pitch DDB Package; 12-Lead Plastic DFN (5mm x 4mm) (see Linear Technology DFN_8_05-08-1702.pdf 8-Lead Plastic Stretched Small Outline.

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