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20 leads; body width 3.9 mm; lead pitch 0.635; (see NXP sot054_po.pdf TO-92 leads molded, wide, drill 0.75mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD Sub-miniature slide switch, EG series, SPDT, https://www.e-switch.com/wp-content/uploads/2022/06/EG.pdf tactile switch, 7.3mm x 6.25mm package, pitch 0.8mm Altera BGA-68 M68 MBGA Altera VBGA V81 BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on standard DIP-4), row spacing 15.24 mm (600 mils THT DIP DIL ZIF 10.16mm 400mil Socket LongPads 24-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 22.86mm 900mil LongPads 64-lead.

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