3
1
Back

WLCSP-90, 10x9 raster, 4.223x3.969mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f303zd.pdf WLCSP-100, 10x10 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=260, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row (from Kicad 4.0.7), script generated Through hole straight socket strip, 1x04, 1.00mm pitch, double rows Through hole pin header SMD 1x13 1.00mm single row Through hole angled socket strip, 1x17, 2.00mm pitch, double rows Surface mounted socket strip THT 1x38 2.00mm single row style1 pin1 left Surface mounted socket strip SMD 1x15 1.00mm single row style1 pin1 left Surface mounted socket strip SMD 2x36 2.00mm double row Through hole IDC header, 2x13, 2.54mm pitch, 8.51mm socket length, double rows Through hole pin header SMD 1x32 1.27mm single row Through hole straight pin header, 2x12, 2.54mm pitch, 8.51mm socket length, double cols.

New Pull Request