Labels Milestones
Back(see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Shrink Small Outline Package (MS) [MSOP], variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads 28-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 24-lead surface-mounted (SMD) DIP package, row spacing 6.73 mm (264 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 8x-dip-switch.
- Size perf. MiniADSR derived from.
- Connector, red D-size flange.
- UF tantalum\nMFOS 1, 1+15 electrolytic\n1 uF.