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Technology DFN_16_05-08-1706.pdf DHD Package; 18-Lead Plastic DFN (2mm x 2mm) (see Linear Technology DFN_32_05-08-1734.pdf DFN44 8.9x5, 0.4P; CASE 506BU-01 (see ON Semiconductor 506AF.PDF DKD Package; 32-Lead Plastic Thin Quad Flatpack No-Lead (LZ) - 2x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf DCB Package 8-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch.

SmallPads 22-lead though-hole mounted DIP package, row.
1x04 2.54mm single row male, vertical.
0.634273 0.099275 facet normal -0.11537 0.000246232 0.993323.
B11B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator.
SOIC, 14 Pin (JEDEC.

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