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BackConnector, B10B-J21DK-GGXR (http://www.jst-mfg.com/product/pdf/eng/eJFA-J2000.pdf), generated with kicad-footprint-generator Molex KK-254 Interconnect System, old/engineering part number: 5273-02A example for new part number: A-41792-0017 example for new mpn: 39-30-0020, 1 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py eSIP-7C Vertical Flat Package with Heatsink Tab, https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 12-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 24-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 10x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size 6.7x19.34mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf E-Switch slide switch, right-angle, http://www.ckswitches.com/media/1422/js.pdf switch spdt 0 3 0 ENDBLK 5 21 330 1F 100 AcDbEntity 67 1 8 0 100 AcDbBlockBegin 2 *PAPER_SPACE 1 (min_thickness 0.254) (filled_areas_thickness no (end -4.5 -4.45 (end -4.5 -4.45 (end -4.5 -4.4 (end 0 -12.827 (end 0 4.435 (end 0 -7.747 (end 0 10.033 (end 1.27 1.27 (end -1.27 -6.35 (end 1.27 -13.97 (end 2.286 1.016 (end -2.286 -1.016 (offset 0.254) hide (end 0 2.413 (end 0 -0.127 (end 0 -12.827 (end 0.
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